Web cookies (also called HTTP cookies, browser cookies, or simply cookies) are small pieces of data that websites store on your device (computer, phone, etc.) through your web browser. They are used to remember information about you and your interactions with the site.
Purpose of Cookies:
Session Management:
Keeping you logged in
Remembering items in a shopping cart
Saving language or theme preferences
Personalization:
Tailoring content or ads based on your previous activity
Tracking & Analytics:
Monitoring browsing behavior for analytics or marketing purposes
Types of Cookies:
Session Cookies:
Temporary; deleted when you close your browser
Used for things like keeping you logged in during a single session
Persistent Cookies:
Stored on your device until they expire or are manually deleted
Used for remembering login credentials, settings, etc.
First-Party Cookies:
Set by the website you're visiting directly
Third-Party Cookies:
Set by other domains (usually advertisers) embedded in the website
Commonly used for tracking across multiple sites
Authentication cookies are a special type of web cookie used to identify and verify a user after they log in to a website or web application.
What They Do:
Once you log in to a site, the server creates an authentication cookie and sends it to your browser. This cookie:
Proves to the website that you're logged in
Prevents you from having to log in again on every page you visit
Can persist across sessions if you select "Remember me"
What's Inside an Authentication Cookie?
Typically, it contains:
A unique session ID (not your actual password)
Optional metadata (e.g., expiration time, security flags)
Analytics cookies are cookies used to collect data about how visitors interact with a website. Their primary purpose is to help website owners understand and improve user experience by analyzing things like:
How users navigate the site
Which pages are most/least visited
How long users stay on each page
What device, browser, or location the user is from
What They Track:
Some examples of data analytics cookies may collect:
Page views and time spent on pages
Click paths (how users move from page to page)
Bounce rate (users who leave without interacting)
User demographics (location, language, device)
Referring websites (how users arrived at the site)
Here’s how you can disable cookies in common browsers:
1. Google Chrome
Open Chrome and click the three vertical dots in the top-right corner.
Go to Settings > Privacy and security > Cookies and other site data.
Choose your preferred option:
Block all cookies (not recommended, can break most websites).
Block third-party cookies (can block ads and tracking cookies).
2. Mozilla Firefox
Open Firefox and click the three horizontal lines in the top-right corner.
Go to Settings > Privacy & Security.
Under the Enhanced Tracking Protection section, choose Strict to block most cookies or Custom to manually choose which cookies to block.
3. Safari
Open Safari and click Safari in the top-left corner of the screen.
Go to Preferences > Privacy.
Check Block all cookies to stop all cookies, or select options to block third-party cookies.
4. Microsoft Edge
Open Edge and click the three horizontal dots in the top-right corner.
Go to Settings > Privacy, search, and services > Cookies and site permissions.
Select your cookie settings from there, including blocking all cookies or blocking third-party cookies.
5. On Mobile (iOS/Android)
For Safari on iOS: Go to Settings > Safari > Privacy & Security > Block All Cookies.
For Chrome on Android: Open the app, tap the three dots, go to Settings > Privacy and security > Cookies.
Be Aware:
Disabling cookies can make your online experience more difficult. Some websites may not load properly, or you may be logged out frequently. Also, certain features may not work as expected.
First-year Ph.D. students Mohammad Mundiwala and Aidan Lawlor from UConn’s Reliability Engineering and Informatics Laboratory (REIL) are contributing to the development of sustainable manufacturing solutions through innovative research in product design and remanufacturing.
Advised by Dr. Chao Hu, associate professor in the School of Mechanical, Aerospace, and Manufacturing Engineering within the College of Engineering, the team is working to help manufacturers extend the life of critical components and reduce environmental impacts through smart, data-driven design strategies.
Their research was recently presented at the 2025 Annual Member Meeting of the U.S. Department of Energy-supported REMADE Institute in Washington, D.C. The presentation highlighted a data-driven software tool that supports design decision-making by forecasting how changes affect cost, energy use, and greenhouse gas emissions over multiple remanufacturing cycles.
This work underscores the potential for integrating sustainability considerations into the early stages of product development—enabling manufacturers to improve remanufacturability, reduce reliance on virgin materials, and contribute to a more circular economy.
🎉 Welcome Dr.Daniele Vivona! 🎉 We are excited to welcome Dr. Daniele Vivona as an Assistant Professor in the School of Mechanical, Aerospace, and Manufacturing Engineering and theUConn Center for Clean Energy Engineeringat the University of Connecticut! Dr. Vivona’s research explores atom-level energy conversion processes to develop innovative design solutions for ion transport and interfacial phenomena in advanced energy materials. His work aims to drive forward next-generation electrochemical energy conversion devices, combining physics-based modeling, atomistic simulations, and data-driven approaches to bridge multiple time and length scales. Dr. Vivona earned his Ph.D. in Mechanical Engineering from MIT, where he was a MathWorks Mechanical Engineering Fellow, a Rohsenow Graduate Fellow, and a member of the MIT Society of Energy Fellows. He also holdsB.Sc. and M.S. degrees in Energy Engineering from the Polytechnic Institute of Milan, and an M.S. in Mechanical Engineering from UConn.
The top three teams in the ASME Autodesk Hackathon challenge
A team of graduate students from our School of MAM’s Computational Engineering and Design (CEaD) Lab won first place in the Autodesk challenge at the ASME IDETC/CIE 2025 Student Hackathon, held August 10–17 in Anaheim, California.
Ph.D. students Kiarash Naghavi Khanghah and Hoang Anh Nguyen, advised by Dr. Hongyi Xu, earned the top spot and a $1,400 prize for their innovative solution.
This year’s hackathon drew more than 55 participants from 33 universities across six countries, challenging students to solve real-world problems in design, manufacturing, and simulation.
The UConn team tackled Autodesk’s DesignQA challenge, which tested how well AI systems could read and reason over complex engineering documents. They built a large language model–based framework that improved rule extraction, reduced model hallucinations, and achieved one of the highest scores on the benchmark, securing their first-place win.
UConn graduate Zihan Wang (’24 PhD) has been honored with the ASME Design Automation Best Dissertation Award for her groundbreaking research in metamaterials. Her dissertation, “Design, Performance Evaluation and Uncertainty Analysis of Metamaterials,” was completed under the guidance of Dr. Hongyi Xu, Associate Professor in the School of Mechanical, Aerospace, and Manufacturing Engineering.
Dr. Wang’s work introduced new methods to design advanced materials using generative AI, predict their properties with deep learning, and better understand the uncertainties involved in their performance.
The ASME Design Automation Dissertation Award is given to recognize one exceptional Ph.D. dissertation in the field each year—or less often—making it a highly selective honor. Dr. Wang received the award at the ASME 2025 IDETC/CIE Conference, highlighting UConn’s leadership in training researchers to take on today’s most complex engineering challenges.
A team of researchers from UConn has received the 2025 ASME Design for Manufacturing and the Life Cycle (DFMLC) Best Paper Award, a national honor given to only one paper each year. The award was presented at the ASME 2025 International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE), held August 10–17 in Anaheim, California.
The winning paper introduces a new artificial intelligence framework that helps detect problems in advanced 3D printing processes, also known as additive manufacturing. By combining powerful language models with scientific data, such as images and text from research articles, the system can automatically spot and explain manufacturing defects without needing prior training on each specific case. The team successfully tested this method on several datasets from Oak Ridge National Laboratory, covering different machines, materials, and conditions.
The research was carried out by Kiarash Naghavi Khanghah, Zhiling Chen, Lela Romeo, Dr. Qian Yang, Dr. Rajiv Malhotra, Dr. Farhad Imani, and Dr. Hongyi Xu, in collaboration across the UConn School of Mechanical, Aerospace, and Manufacturing Engineering, the UConn School of Computing, and the Rutgers Department of Mechanical and Aerospace Engineering.
University Scholar Zhengyang Wei ’26 is exploring ways to improve the stability and performance of aerodynamic designs.
Zhengyang Wei ’26, a mechanical engineering major and University Scholar, is conducting advanced research to improve the stability and efficiency of aerodynamic systems. His project focuses on analyzing shear flows, where fluid layers move at different speeds, to understand and prevent turbulence, a key challenge in fluid dynamics. Using mathematical models and stability theorems, Wei’s work aims to enhance the performance of systems like aircraft by reducing turbulent transitions.
Working under the guidance of faculty members Chang Liu, Reza Sheikhi, and Jason Lee in the School of Mechanical, Aerospace, and Manufacturing Engineering, Wei has already co-published a research paper and received a 2025 Summer Undergraduate Research Fund (SURF) award. As a member of the FLUENT Lab and a math minor, he plans to pursue a Ph.D. in fluid stability or optimization.
In a paper published as an Editor’s Pick in Applied Physics Letters, College of Engineering’s Georges Pavlidis outlines ways to manage heat in high-speed electronic.
When electronic devices overheat, they can slow down, malfunction, or stop working altogether. This heat is mainly caused by energy lost as electrons move through a material—similar to friction in a moving machine.
Most devices today use silicon (Si) as their semiconductor material. However, engineers are increasingly turning to alternatives like gallium nitride (GaN) for longer lifetime use and higher performance. This includes products such as LEDs, compact laptop chargers, and 5G phone networks. For even more extreme applications—such as high-voltage systems or harsh environments—researchers are exploring ultrawide bandgap (UWBG) materials like gallium oxide (Ga2O3), aluminum gallium nitride (AlGaN), and even diamond.
Pictured in center, Georges Pavlidis, assistant professor of mechanical engineering, and School of Mechanical, Aerospace, and Manufacturing Engineering Ph.D. candidates Francis Vásquez, at left, and Dominic Myren, are co-authors of a “Perspectives” paper published in Applied Physics Letters. Together, they’re exploring thermal management strategies in ultra side bandgap semiconductor devices. (Sarah Redmond/UConn Photo)
The key difference between these materials lies in their electronic bandgap—the energy needed to get electrons to flow through the material. Wider bandgaps allow companies to reduce the size of their electronics and make them more electrically efficient.
“UWBG materials can resist up to 8,000 volts and can operate at temperatures over 200 °C (392°F), making them promising for the next generation of electronics in the energy, health, and communication sectors,” explains Georges Pavlidis, assistant professor of mechanical engineering.
While these materials offer promising advantages, they also come with challenges. They’re currently expensive, difficult to manufacture, and their thermal behavior is hard to measure precisely. As electronics become more powerful and in smaller dimensions, the heating in the device becomes more localized and can generate a heat flux greater than the sun, Pavlidis explains.
“Chip manufacturers need new methods to measure temperature in smaller dimensions,” he says.
Pavlidis, along with UConn’s School of Mechanical, Aerospace, and Manufacturing Engineering Ph.D. candidates Dominic Myren and Francis Vásquez, collaborated with colleagues from the U.S. Naval Research Laboratory over the past year to tackle the challenge of measuring the heat output. Their work resulted in a “Perspectives” paper published in Applied Physics Letters.
As the body ages, a network of proteins and other molecules may structurally change, leading to a loss of elasticity and tissue strength in skin, joints, and arteries. This can lead to reduced muscle mass, stiffness, and increased susceptibility to chronic diseases like osteoarthritis.
Anna Tarakanova, assistant professor of mechanical engineering and biomedical engineering, leads a research group in UConn’s College of Engineering (CoE) that uses advanced computer models to study the mechanical properties of proteins.
In doing so, she’s developing nature-inspired materials that can mimic the flexibility of elastin or the durability of collagen. These designs could lead to innovations in medical devices, prosthetics, or even “repurpose” molecules for resilience in aging.
“Ultimately, our goal is to understand aging and disease at a basic, molecular level and how that fits into the bigger picture of how complex biological systems function,” Tarakanova explains.
Osama Bilal, director of the Wave Engineering Laboratory for Extreme and Intelligent Matter (on right), and Doctoral Student Mahmoud Samak are co-authors of a new paper documenting research into innovative soundwave technologies. (Christopher LaRosa / UConn College of Engineering Photo)
A team of UConn College of Engineering (CoE) researchers have achieved a major milestone in the field of Phononics with the first experimental demonstration of an all-flat phononic band structure (AFB). Phononics concerns the study of sound and heat control. A breakthrough, detailed in an article just published in Physical Review Letters, introduces a new class of materials capable of uniquely controlling sound and vibrations by trapping energy with unprecedented intensity, offering exciting possibilities for potential applications in acoustics, vibration insulation, energy harvesting, and beyond.
The work, led by Professor Osama Bilal, director of the Wave Engineering Laboratory for Extreme and Intelligent Matter (We-Xite), unlocks a new recipe for engineering materials with exotic behavior. In the experiments, the material serves a double function, Bilal explains, by being a perfect sound vacuum and wave amplifier at the same time.